FS32K112BFT0M datasheet(73/85 Pages) NXP

73 / 85 page

Table 42. Thermal characteristics for the 100 MAPBGA package

Rating

Conditions

Symbol

Values

Unit

S32K146

S32K144

S32K148

Thermal resistance, Junction to Ambient (Natural

Convection) 1, 2

Single layer board (1s)

RθJA

57.2

61.0

52.5

°C/W

Thermal resistance, Junction to Ambient (Natural

Convection) 1, 2, 3

Four layer board

(2s2p)

RθJA

32.1

35.6

27.5

°C/W

Thermal resistance, Junction to Ambient (@200 ft/min) 1, 2, 3 Single layer board (1s)

RθJMA

44.1

46.6

39.0

°C/W

Thermal resistance, Junction to Ambient (@200 ft/min)1, 3

Two layer board

(2s2p)

RθJMA

27.2

30.9

22.8

°C/W

Thermal resistance, Junction to Board4

—

RθJB

15.3

18.9

11.2

°C/W

Thermal resistance, Junction to Case 5

—

RθJC

10.2

14.2

7.5

°C/W

Thermal resistance, Junction to Package Top outside

center6

—

ψJT

0.2

0.4

0.2

°C/W

Thermal resistance, Junction to Package Bottom outside

center7

—

ψJB

12.2

15.9

18.3

°C/W

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air

flow, power dissipation of other components on the board, and board thermal resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the

package.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek

letters are not available, the thermal characterization parameter is written as Psi-JT.

Thermal characterization parameter indicating the temperature difference between package bottom center and the junction temperature per JEDEC JESD51-12.

When Greek letters are not available, the thermal characterization parameter is written as Psi-JB.

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