TLOU248(F)

2007-10-01

1

TOSHIBA LED Lamp InGaAℓP Orange Light Emission

TLOU248(F)

Panel Circuit Indicator

• Lead(Pb)-free products (lead: Sn-Ag-Cu)

• InGaAℓP orange LED

• Elliptical lens: Colored transparent lens

• Wide radiation

• Low drive current, high intensity orange light emission

• Plastic molded colored transparent lens provides for high contrast of

on−off ratio.

• Fast response time, capable of pulse operation.

• Applications: Suitable for outdoor message signboard, full color panel,

backlight.

Characteristic

Symbol

Rating

Unit

Forward current

30

mA

Reverse voltage

4

V

Power dissipation

72

mW

Operating temperature range

−30~85

°C

Storage temperature range

−40~120

°C

Note: Using continuously under heavy loads (e.g. the application of high

temperature/current/voltage and the significant change in temperature, etc.) may cause this product to

decrease in the reliability significantly even if the operating conditions (i.e. operating

temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

Forward voltage

IF = 20 mA

―

2.0

2.4

V

Reverse current

―

―

50

μA

Luminous intensity

IF = 20 mA

(Note)

85

300

―

mcd

Peak emission wavelength

―

(612)

―

nm

Spectral line half width

Δλ

―

15

―

nm

Dominant wavelength

λd

―

605

―

nm

Note:Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes

single Luminous Intensity class.

N: 85-230mcd, P: 153-414mcd, Q: 272mcd-

Precaution

Please be careful of the followings

• Soldering temperature: 260°C max

Soldering time: 3 s max

(Soldering portion of lead: below the lead stopper of the device)

• If the lead is formed, the lead should be formed up to below the lead stopper of the device without forming stress

to the resin. Soldering should be performed after lead forming.

• This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure

that it will not be affected by this IR light.

Unit in mm

JEDEC

―

JEITA

―

TOSHIBA

4-5AP1

Weight: 0.3 g(Typ.)