DATA SHEET • SE2623L-R: 2.4 GHz HIGH POWER WIRELESS LAN POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202397J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 11, 2020

9

Package Dimensions

Typical part markings for the SE2623L-R are shown in Figure 6.

The PCB layout footprint for the SE2623L-R is provided in

Figure 7. Package dimensions are shown in Figure 8, and tape

and reel dimensions are provided in Figure 9.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it

is baked and vacuum packed before shipping. Instructions on

the shipping container label regarding exposure to moisture

after the container seal is broken must be followed. Otherwise,

problems related to moisture absorption may occur when the

part is subjected to high temperature during solder assembly.

The SE2623L-R is rated to Moisture Sensitivity Level 3 (MSL3)

at 260

C, and can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

Solder Reflow Information (Document Number 200164).

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.

Pin 1

Indicator

Part Number

Y0744

SKY

2623L

XXXXX

SiGe

2623L

XXXXX

Lot Code

Figure 6. SE2623L-R Typical Part Markings

(Top View)