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6.2 Package Outline

Figure 6. Dimensional drawing of SHT41A-AWSB with wettable flanks, including package tolerances

(units mm).

6.3 Land Pattern

The land pattern is recommended to be designed according to the used PCB and soldering process together

with the physical outer dimensions of the sensor. For reference, the land pattern used with Sensirion’s PCBs

and soldering processes is given in Figure 10 & Figure 11 for the wettable flanks option. Soldering of the central

die pad, as well as an exposed copper pad underneath it, is not recommended by Sensirion due to it acting as

a heat sink which prevents the heater from functioning according to its specifications.

Figure 7. Recommended land pattern (in mm). Details can vary and depend on used PCBs and solder

processes. There shall be no copper under the sensor other than at the pin pads.