Model

Package Power @ 70°C(watts)4

694

0.4

698

0.6

699

0.6

Nichrome Resistor Networks

on Ceramic Substrates

Model 694, 698, 699 Series

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General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

© TT electronics plc

10.13

Package Power And Derating Curve

Thermal Shock plus Power Conditioning

ΔR 0.25%

Short Time Overload

ΔR 0.1%

Terminal Strength

ΔR 0.1%

Moisture Resistance

ΔR 0.2%

Mechanical Shock

ΔR 0.25%

Vibration

ΔR 0.25%

Low Temperature Operation

ΔR 0.1%

High Temperature Exposure

ΔR 0.1%

Load Life, 1,000 Hours

ΔR 0.1%

Resistance to Solder Heat

ΔR 0.1%

Dielectric Withstanding Voltage

200V for 1 minute

Marking Permanency

MIL-STD-202, Method 215

Lead Solderability

MIL-STD-202, Method 208

Flammability

UL-94V-0 Rated

Storage Temperature Range

-65°C to +125°C

Lead Plating

100 matte Tin (RoHS)

Lead Material

Copper Alloy

Lead Configuration

Thru hole

Substrate Material

Alumina

Resistor Material

Passivated Nichrome

Body Material

Molded Epoxy

Environmental (Mil-R-83401)

Mechanical

4 Maximum power per resistor @ 70°C is 100 mW, not to exceed package power

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BI Technologies Corporation

4200 Bonita Place

Fullerton, CA 92835 USA

Website: www.bitechnologies.com

May 29, 2008

page 2 of 3

BI technologies

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Model

Package Power @ 70°°°°C(watts)

4

694

0.4

698

0.6

699

0.6





















Thermal Shock plus Power Conditioning

∆R 0.25%

Short Time Overload

∆R 0.1%

Terminal Strength

∆R 0.1%

Moisture Resistance

∆R 0.2%

Mechanical Shock

∆R 0.25%

Vibration

∆R 0.25%

Low Temperature Operation

∆R 0.1%

High Temperature Exposure

∆R 0.1%

Load Life, 1,000 Hours

∆R 0.1%

Resistance to Solder Heat

∆R 0.1%

Dielectric Withstanding Voltage

200V for 1 minute

Marking Permanency

MIL-STD-202, Method 215

Lead Solderability

MIL-STD-202, Method 208

Flammability

UL-94V-0 Rated

Storage Temperature Range

-65°C to +125°C









Lead Plating

80/20 Tin Lead (Standard)

100 matte Tin (RoHS)

Lead Material

Copper Alloy

Lead Configuration

Thru hole

Substrate Material

Alumina

Resistor Material

Passivated Nichrome

Body Material

Molded Epoxy

4

Maximum power per resistor @ 70°C is 100 mW, not to exceed package power

OBSOLETE