®

INA101

3

PIN CONFIGURATIONS

Top View

10

1

5

3

4

–In

+In

Gain

Set

Offset

Adjust

Offset

Adjust

Gain Set

2

9

8

7

6

–V

CC

Common

Output

+V

CC

1

2

3

4

5

6

7

14

13

12

11

10

9

8

Output

+V

CC

–Input

Gain Sense 1

Gain Set 1

Offset Adj.

Offset Adj.

Common

–V

CC

+Input

Gain Sense 2

Gain Set 2

A2 Output

A1 Output

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

Output

+V

CC

–Input

Gain Sense 1

Gain Set 1

Offset Adj.

Offset Adj.

NC

Common

–V

CC

+Input

Gain Sense 2

Gain Set 2

A2 Output

A1 Output

NC

DIP

G and P Package

SOIC

U Package

TO-100

M Package

ORDERING INFORMATION

PRODUCT

PACKAGE

TEMPERATURE RANGE

INA101AM

10-Pin Metal TO-100

–25

°C to +85°C

INA101CM

10-Pin Metal TO-100

–25

°C to +85°C

INA101AG

14-Pin Ceramic DIP

–25

°C to +85°C

INA101CG

14-Pin Ceramic DIP

–25

°C to +85°C

INA101HP

14-Pin Plastic DIP

0

°C to +70°C

INA101KU

SOL-16 Surface-Mount

0

°C to +70°C

INA101SG

14-Pin Ceramic DIP

–55

°C to +125°C

INA101SM

10-Pin Metal TO-100

–55

°C to +125°C

ABSOLUTE MAXIMUM RATINGS

Supply Voltage ...................................................................................

±20V

Power Dissipation .......................................................................... 600mW

Input Voltage Range ..........................................................................

±V

CC

Output Short Circuit (to ground) ............................................... Continuous

Operating Temperature M, G Package ........................... –55

°C to +125°C

P, U Package ................................................................. –25

°C to +85°C

Storage Temperature M, G Package .............................. –65

°C to +150°C

P, U Package ................................................................. –40

°C to +85°C

Lead Temperature (soldering, 10s) M, G, P Package ................... +300

°C

Lead Temperature (wave soldering, 3s) U Package ...................... +260

°C

PACKAGE INFORMATION

PACKAGE DRAWING

PRODUCT

PACKAGE

NUMBER(1)

INA101AM

10-Pin Metal TO-100

007

INA101CM

10-Pin Metal TO-100

007

INA101AG

14-Pin Ceramic DIP

169

INA101CG

14-Pin Ceramic DIP

169

INA101HP

14-Pin Plastic DIP

010

INA101KU

SOL-16 Surface-Mount

211

INA101SG

14-Pin Ceramic DIP

169

INA101SM

10-Pin Metal TO-100

007

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix D of Burr-Brown IC Data Book.

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with ap-

propriate precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.