3.2

March 26, 2021

ES9016K2M Datasheet

ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-

8800 • www.esstech.com

34

Example 28-Pin QFN Land Pattern

Notes:

1.

All dimensions are in millimeters.

2.

Thermal vias should be 0.3mm to 0.33mm in diameter, with the barrel plated to 1oz copper.

3.

For maximum solder mask in the corners, round the inner corners of each row.

4.

Exposed pad should be solder mask defined.

5.

Pad width can be reduced to 0.25mm if additional pad to pad clearance is required.

6.

For applications where solder loss through vias is a concern, plugging or tenting of the vias should be used. The

solder mask diameter for each via should be 0.1mm larger than the via diameter.