LM1894

SNAS551C – DECEMBER 1994 – REVISED APRIL 2013

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Typical Application

*R1 + R2 = 1 k

Ω total.

See Application Hints.

Figure 1. Component Hook-Up for Stereo DNR System

14-Pin SOIC or PDIP or TSSOP

See D or NFF0014A or PW Package

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Supply Voltage

20V

Input Voltage Range, Vpk

VS/2

Operating Temperature(3)

0°C to +70°C

Storage Temperature

−65°C to +150°C

PDIP Package

Soldering (10 seconds)

260°C

Soldering Information

Vapor Phase (60 seconds)

215°C

SOIC Package

Infrared (15 seconds)

220°C

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

For operation in ambient temperature above 25°C, the device must be derated based on a 150°C maximum junction temperature and a

thermal resistance of:

(a) 80°C/W junction to ambient for the PDIP package,

(b) 105°C/W junction to ambient for the SOIC package, and

(c) 150°C/W junction to ambient for the TSSOP package.

2

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