2

LM2758

SNVS551E – APRIL 2008 – REVISED MAY 2016

www.ti.com

Product Folder Links: LM2758

Submit Documentation Feedback

Copyright © 2008–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ..................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 6

7

Detailed Description .............................................. 7

7.1

Overview ................................................................... 7

7.2

Functional Block Diagram ......................................... 7

7.3

Feature Description................................................... 7

7.4

Device Functional Modes........................................ 10

8

Application and Implementation ........................ 11

8.1

Application Information............................................ 11

8.2

Typical Application ................................................. 11

9

Power Supply Recommendations ...................... 14

9.1

Power Dissipation ................................................... 14

10

Layout................................................................... 15

10.1

Layout Guidelines ................................................. 15

10.2

Layout Example .................................................... 15

10.3

DSBGA Package Assembly and Use ................... 16

11

Device and Documentation Support ................. 17

11.1

Device Support...................................................... 17

11.2

Documentation Support ........................................ 17

11.3

Community Resources.......................................... 17

11.4

Trademarks ........................................................... 17

11.5

Electrostatic Discharge Caution ............................ 17

11.6

Glossary ................................................................ 17

12

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2013) to Revision E

Page

•

Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description,

Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and

Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................. 1

•

Added Thermal Information table with revised RθJA value (from 56°C/W to 93.6°C/W) and additional thermal values. ....... 4

Changes from Revision C (May 2013) to Revision D

Page

•

Changed layout of National Semiconductor Data Sheet to TI format ................................................................................. 16