SLG51002

PMIC with High PSRR, Low Noise, Multi-Output LDOs

and Integrated Load Switches

Datasheet

Revision 3.11

25-Jul-2023

CFR0011-120-00

2 of 36

© 2023 Renesas Electronics Corporation

Contents

General Description .............................................................................................................................1

Key Features.........................................................................................................................................1

Applications..........................................................................................................................................1

Contents................................................................................................................................................2

Figures ..................................................................................................................................................3

Tables ....................................................................................................................................................3

1

Block Diagram ................................................................................................................................4

2

Pinout ..............................................................................................................................................5

2.1

Input Pins ...............................................................................................................................7

2.1.1

CS

– Chip Select ....................................................................................................7

2.1.2

SCL

– I2C Clock......................................................................................................8

2.2

Bidirectional Pins ...................................................................................................................8

2.2.1

GPIO1 to GPIO5 and GPI6

– General Purpose Input/Output................................8

2.2.2

SDA

– I2C Data.......................................................................................................8

3

Characteristics ...............................................................................................................................9

3.1

Absolute Maximum Ratings ...................................................................................................9

3.1.1

Guidelines for Reliable Operation ..........................................................................9

3.2

Recommended Operating Conditions .................................................................................10

3.3

Thermal Characteristics.......................................................................................................10

3.4

Current Consumption...........................................................................................................11

3.5

Chip Select Digital I/O Characteristics.................................................................................11

3.6

Digital I/O Characteristics ....................................................................................................12

3.7

LDO_HV Characteristics......................................................................................................16

3.8

LDO_HC Characteristics .....................................................................................................21

3.8.1

Load Switch Mode Characteristics.......................................................................24

3.9

LDO_LV Characteristics ......................................................................................................25

3.9.1

Load Switch Mode Characteristics.......................................................................28

3.10 VREF, IREF, Temperature Supervision Characteristics .....................................................29

3.11 Internal Oscillator Characteristics........................................................................................30

3.12 UVLO Characteristics ..........................................................................................................31

4

Package Information....................................................................................................................32

4.1

Package Outlines.................................................................................................................32

4.2

Moisture Sensitivity Level ....................................................................................................33

4.3

Recommended Landing Pattern..........................................................................................34

4.4

WLCSP Handling.................................................................................................................34

4.5

Soldering Information...........................................................................................................35

5

Ordering Information ...................................................................................................................36