LP3988

SNVS161E – OCTOBER 2001 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

IN pin

−0.3

6.5

V

OUT, EN, PG pins

−0.3

See(4)

V

Junction temperature, TJ

150

°C

SOT-23-5

469

Power dissipation(5)

mW

DSBGA

441

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

The lesser of VIN + 0.3 V or 6 V.

(5)

The absolute maximum power dissipation depends on the ambient temperature and the RθJA value; it can be calculated using the

formula: PD = (TJ – TA)/RθJA where TJ(MAX) is the maximum junction temperature, TA(MAX) is the maximum expected ambient

temperature, and RθJA is the junction-to-ambient thermal resistance.The 469-mW rating for the SOT-23-5 package results from

substituting the junction temperature, 150°C, for TJ(MAX), 70°C for TA, and 181.2°C/W for RθJA. More power can be dissipated safely at

ambient temperatures below 70°C . Less power can be dissipated safely at ambient temperatures above 70°C. The absolute maximum

power dissipation can be increased by 5.86 mW for each degree below 70°C, and it must be derated by 5.86 mW for each degree

above 70°C. Same principle applies to the DSBGA package.

6.2 ESD Ratings

VALUE

UNIT

LP3988 IN SOT-23 PACKAGE

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±150

LP3988 IN DSBGA PACKAGE

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4

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