PCM1723

2

SBAS057A

www.ti.com

PIN

NAME

TYPE

FUNCTION

1

XTI

IN

Master Clock Input.

2

SCKO

OUT

System Clock Out. This output is 256fS or 384fS.

system clock generated by the internal PLL.

3VCP

PWR

PLL Power Supply (+5V).

4

NC

N/A

No connection.

5

MCKO

Out

Buffered clock output of crystal oscillator.

6(1)

ML

IN

Latch for serial control data.

7(1)

MC

IN

Clock for serial control data.

8(1)

MD

IN

Data for serial control.

9(1)

RSTB

IN

Reset Input. When this pin is low, the digital

filters and modulators are held in reset.

10

ZERO

OUT

Zero Data Flag. This pin is low when the input

data is continuously zero for more than 65, 535

cycles of BCKIN.

11

VOUTR

OUT

Right Channel Analog Output.

12

AGND

GND

Analog Ground.

13

VCC

PWR

Analog Power Supply (+5V).

14

VOUTL

OUT

Left Channel Analog Output.

15

CAP

Common pin for analog output amplifiers.

16(2)

BCKIN

IN

Bit clock for clocking in the audio data.

17(2)

DIN

IN

Serial audio data input.

18(2)

LRCIN

IN

Left/Right Word Clock. Frequency is equal to fS.

19

NC

N/A

No connection.

20

RES

N/A

Reserved for factory use, do not connect.

21

VDD

PWR

Analog Power Supply (+5V).

22

DGND

GND

Digital Ground.

23

PGND

GND

PLL Ground.

24

XTO

Out

Crystal oscillator output.

NOTES: (1) Schmitt trigger input with internal pull-up resistors.

(2) Schmitt triger input.

PIN ASSIGNMENTS

PIN CONFIGURATION

TOP VIEW

SSOP

PACKAGE INFORMATION(1)

PACKAGE

PRODUCT

PACKAGE

DESIGNATOR

PCM1723E

24-Pin SSOP

DB

NOTE: (1) For the most current package and ordering information, see the

Package Option Addendum at the end of this data sheet, or see the TI web

site at www.ti.com

ABSOLUTE MAXIMUM RATINGS(1)

Power Supply Voltage ...................................................................... +6.5V

+VCC to +VDD Difference ................................................................... ±0.1V

Input Logic Voltage .................................................. –0.3V to (VDD + 0.3V)

Input Current (except power supply) ...............................................

±10mA

Power Dissipation .......................................................................... 530mW

Operating Temperature Range ......................................... –25

°C to +85°C

Storage Temperature ...................................................... –55

°C to +125°C

Lead Temperature (soldering, 5s) .................................................. +260

°C

Thermal Resistance,

θ

JA ....................................................................................... +70°C/W

NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

XTI

SCKO

V

CP

NC

MCKO

ML

MC

MD

RSTB

ZERO

V

OUTR

AGND

XTO

PGND

DGND

V

DD

RES

NC

LRCIN

DIN

BCKIN

CAP

V

OUTL

V

CC

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause

damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.