MIC5166 datasheet(14/36 Pages) MICROCHIP

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MIC5166

DS20006085B-page 14

 2018 - 2019 Microchip Technology Inc.

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

Pin Number

Pin Name

Description

1VREF

Reference Voltage. This output provides an output of the internal reference voltage

VDDQ/2. The VREF output is used to provide the reference voltage for the memory chip.

Connect a 1.0 µF capacitor to ground at this pin. This pin can sink and source 10 mA.

2BIAS

BIAS Supply Voltage. The BIAS supply is the power MOSFET gate drive supply volt-

age and the supply bus for the IC. The BIAS voltage must be greater than (VTT +

2.2V). A 1.0 µF ceramic capacitor from the BIAS pin to PGND must be placed next to

the IC.

AGND

Analog Ground. Internal signal ground for all low-power circuits.

VDDQ

Input Supply. VDDQ is connected to an internal precision divider that provides the

VREF. Connect a 4.7 µF capacitor to ground at this pin.

5PG

Power Good. This is an open-drain output that indicates when the output voltage is

within ±10% of the reference voltage. The PG flag is asserted typically with 65 µs delay

when the enable is set low or when the output goes outside ±10% the window thresh-

old.

SNS

Feedback. Input to the error amplifier.

7EN

Enable. Logic level control of the output. Logic high enables the MIC5166 and a logic

low shuts down the MIC5166. In the off state, supply current of the device is greatly

reduced (typically 0.2 µA). The EN pin should not be left open.

8PGND

Power Ground. Internal ground connection to the source of the internal, low-side drive,

N-channel MOSFET.

9VTT

Power Output. This is the connection to the source of the internal high-side N-channel

MOSFET and drain of the low-side N-channel MOSFET. This is a high-frequency,

high-power connection, therefore two 10 µF output capacitors must be placed as close

to the IC as possible.

VIN

High-Side N-Channel MOSFET Drain Connection. The VIN operating voltage range is

from 0.9V to 3.6V. An input capacitor between the VIN pin and the PGND is required

as close to the chip as possible.

ePAD

Exposed Pad. Must be connected to a GND plane for best thermal performance.

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