STANDARD APPLICATION

2

4

6

8

19

20

11

9

Margin Up

V

I

Track

+Sense

+

PTH12040W

V

I

V

I

UVLO Prog

Margin Down

18

Track

12

15

14

V

O

V

O

V

O

–Sense

7

1

Inhibit

17

GND

3

5

10

13

16

GNDGND

GND GND GND V

OAdjust

Track

Margin Up

Margin Down

C

I

560 mF

(Required)

R

SET

1%

0.05 W

L

O

A

D

+Sense

C

O1

330 mF

(Required)

C

O2

330 mF

(Required)

+

+

V

O

–Sense

GND

GND

V

I

Inhibit

UDG-08112

ABSOLUTE MAXIMUM RATINGS

PTH12040W

SLTS237G – DECEMBER 2004 – REVISED MARCH 2009............................................................................................................................................... www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

A.

RSET = Required to set the output voltage higher than the minimum value (see the elcetrical characheristics for

values.)

B.

CI = Required 560-µF electrolytic capacitor. 1000 µF recommended.

C.

CO = Required 660-µF (or 680 µF) electrolytic capacitor.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

over operating free-air temperature range (unless otherwise noted)

UNIT

Signal input voltages

Track control (pin 18)

–0.3 V to VI + 0.3 V

TA

Operating temperature range over VI range

–40°C to 85°C

PTH12040WAH

Wave solder

Surface temperature of module body or pins

Twave

260°C (1)

temperature

(5 seconds maximum)

PTH12040WAD

PTH12040WAS

235°C (1)

Solder reflow

Treflow

Surface temperature of module body or pins

temperature

PTH12040WAZ

260°C (1)

Tstg

Storage temperature

Storage temperature of module removed from shipping package

–55°C to 125°C

Tpkg

Packaging temperature

Shipping Tray storage or bake temperature

45°C

Mechanical shock

Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted

500 G

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20–2000 Hz

15 G

Weight

17 grams

Flammability

Meets UL94V-O

(1)

During the soldering process, do not elevate peak temperature of the module, pins, or internal components above the stated maximum.

2

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