LT6003/LT6004/LT6005

17

600345f

PACKAGE DESCRIPTION

S5 Package

5-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1635)

DC Package

4-Lead Plastic DFN (2mm × 2mm)

(Reference LTC DWG # 05-08-1724 Rev A)

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45 TYP

5 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S5 TSOT-23 0302 REV B

PIN ONE

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

2.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

BOTTOM VIEW—EXPOSED PAD

1.35 REF

0.75

±0.05

0.40

±0.05

0.70

±0.05

1

4

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DC4) DFN 0506 REV A

0.23

± 0.05

R = 0.05

TYP

0.45 BSC

0.25

± 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDEDED

1.30

±0.05

2.00

±0.05

PACKAGE

OUTLINE

0.45 BSC

1.35 REF

PIN 1 NOTCH

R = 0.20 OR

0.25

× 45°

CHAMFER

R = 0.115

TYP

1.35

± 0.10

1.00

± 0.10

1.35

±0.05

1.00

±0.05