CC0402MP6 datasheet(16/21 Pages) YAGEO

16 / 21 page

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Dec. 06, 2022 V.30

General Purpose & High Cap. X5R 4 V to 50 V

Surface Mount Multilayer Ceramic Capacitors

Product specification

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Resistance to

Soldering

Heat

4.9

Precondition: 150 +0/–10 °C for 1 hour, then keep for

24 ± 1 hours at room temperature

Preheating: for size ≤ 1206: 120 °C to 150 °C for 1

minute

Preheating: for size >1206: 100 °C to 120 °C for 1

minute and 170 °C to 200 °C for 1 minute

Solder bath temperature: 260 ± 5 °C

Dipping time: 10 ± 0.5 seconds

Recovery time: 24 ±2 hours

Dissolution of the end face plating shall

not exceed 25% of the length of the

edge concerned

∆C/C

Class2:

X5R: ± 10%

∆C/C

Class2:

X5R: ± 10%

D.F. within initial specified value

Rins within initial specified value

Solderability

4.10

Preheated the temperature of 80 °C to 140 °C and

maintained for 30 seconds to 60 seconds.

1. Temperature: 235± 5°C / Dipping time: 2 ± 0.5 s

2. Temperature: 245± 5°C / Dipping time: 3 ± 0.5 s

(lead free)

Depth of immersion: 10mm

The solder should cover over 95% of

the critical area of each termination

Rapid Change

Temperature

IEC 60384-

21/22

4.11

Preconditioning;

150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at

room temperature

5 cycles with following detail:

30 minutes at lower category temperature

30 minutes at upper category temperature

Recovery time 24 ± 2 hours

No visual damage

∆C/C

Class2:

X5R: ± 15%

∆C/C

Class2:

X5R: ± 15%

D.F. meet initial specified value

Rins meet initial specified value

Voltage Proof IEC 60384-1 4.6

1. Specified stress voltage applied for 1~5 seconds

2. Ur ≤ 100 V: series applied 2.5 Ur

3. 100 V < Ur ≤ 200 V series applied (1.5 Ur + 100)

4. 200 V < Ur ≤ 500 V series applied (1.3 Ur + 100)

Charge/Discharge current is less than 50 mA

No breakdown or flashover

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