5

SN74LVC2G02

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SCES194N – APRIL 1999 – REVISED MAY 2019

Product Folder Links: SN74LVC2G02

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Copyright © 1999–2019, Texas Instruments Incorporated

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

6.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

VCC

Supply voltage

Operating

1.65

5.5

V

Data retention only

1.5

VIH

High-level input voltage

VCC = 1.65 V to 1.95 V

0.65 × VCC

V

VCC = 2.3 V to 2.7 V

1.7

VCC = 3 V to 3.6 V

2

VCC = 4.5 V to 5.5 V

0.7 × VCC

VIL

Low-level input voltage

VCC = 1.65 V to 1.95 V

0.35 × VCC

V

VCC = 2.3 V to 2.7 V

0.7

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

VCC = 1.65 V

–4

mA

VCC = 2.3 V

–8

VCC = 3 V

–16

–24

VCC = 4.5 V

–32

IOL

Low-level output current

VCC = 1.65 V

4

mA

VCC = 2.3 V

8

VCC = 3 V

16

24

VCC = 4.5 V

32

Δt/Δv

Input transition rise or fall rate

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

20

ns/V

VCC = 3.3 V ± 0.3 V

10

VCC = 5 V ± 0.5 V

5

TA

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

SN74LVC2G02

UNIT

DCT (SSOP)

DCU (VSSOP)

YZP (DSBGA)

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

182.8

201.8

99.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

87.8

93.3

1.0

°C/W

RθJB

Junction-to-board thermal resistance

97.9

124.0

27.8

°C/W

ψJT

Junction-to-top characterization parameter

20.7

32.3

0.4

°C/W

ψJB

Junction-to-board characterization parameter

96.6

123.6

27.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W