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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LWW5SN 데이터시트(PDF) 12 Page - OSRAM GmbH |
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LWW5SN 데이터시트(HTML) 12 Page - OSRAM GmbH |
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12 / 18 page  2007-08-16 12 LW W5SN Empfohlenes Lötpaddesign 8) Seite 18 IR Reflow Löten Recommended Solder Pad 8) page 18 IR Reflow Soldering Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected Thermal enhanced PCB Thermisch optimiertes PCB 3 Lötstellen 3 solder points 1.6 (0.063) 11.6 (0.457) ø4.0 (0.157) Heatsink attach 11.6 (0.457) 12.0 (0.472) ø4.0 (0.157) ø2.5 (0.098) Kupfer Copper 1.6 (0.063) OHPY2844 Solder paste stencil Lötpasten Schablone Lötstopplack Solder resist Bare Copper Freies Kupfer |
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