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TMP103CYFFR.B 데이터시트(PDF) 2 Page - Texas Instruments

부품명 TMP103CYFFR.B
상세설명  TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP
PDF  30 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments

TMP103CYFFR.B 데이터시트(HTML) 2 Page - Texas Instruments

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TMP103
SBOS545D – FEBRUARY 2011 – REVISED DECEMBER 2018
www.ti.com
Product Folder Links: TMP103
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 3
6.1
Absolute Maximum Ratings ...................................... 3
6.2
ESD Ratings.............................................................. 3
6.3
Recommended Operating Conditions ....................... 3
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics........................................... 4
6.6
Timing Requirements ................................................ 5
6.7
Typical Characteristics .............................................. 9
7
Detailed Description ............................................ 10
7.1
Overview ................................................................. 10
7.2
Functional Block Diagram ....................................... 10
7.3
Feature Description................................................. 11
7.4
Device Functional Modes........................................ 11
7.5
Programming........................................................... 11
7.6
Register Maps ......................................................... 16
8
Application and Implementation ........................ 19
8.1
Application Information............................................ 19
8.2
Typical Application ................................................. 19
9
Power Supply Recommendations ...................... 21
10
Layout................................................................... 21
10.1
Layout Guidelines ................................................. 21
10.2
Layout Example .................................................... 21
11
Device and Documentation Support ................. 22
11.1
Receiving Notification of Documentation Updates 22
11.2
Community Resources.......................................... 22
11.3
Trademarks ........................................................... 22
11.4
Electrostatic Discharge Caution ............................ 22
11.5
Glossary ................................................................ 22
12
Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (October 2018) to Revision D
Page
•
Changed input voltage maximum value in the Absolute Maximum Ratings table from: (V
+) + 0.5) and ≤ 4 to (V+) +
0.3) and
≤ 4 ............................................................................................................................................................................ 3
Changes from Revision A (March 2011) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
•
Added SSDs, Servers, Telecom, Set Top Boxes, Low Power Environmental, and Sensors to Applications section............ 1
Changes from Original (February 2011) to Revision A
Page
•
Changed Package-Lead from WCSP-4 to DSBGA-4 in Device Information table ................................................................ 1



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