6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

DVDD0P9, VDDT0P9

Supply voltage 0.9V

0.9

0.925

0.95

V

VDD1P2{RX/TXCLK/TXENC/FB/PLL/

PLLCLKREF/FBCML/RXCML}

Supply voltage 1.2V

1.15

1.2

1.25

V

VDD1P8{RX/RXCLK/TX/TXDAC/

TXENC/PLL/PLLVCO/FB/FBCLK/

GPIO}, VDDA1P8

Supply voltage 1.8V

1.75

1.8

1.85

V

TA

Ambient temperature

–40

85

°C

TJ

Operating Junction Temperature

110(1)

°C

Maximum Operating Junction Temperature

125

°C

(1)

Prolonged use at or above this junction temperature can increase the device failure-in-time (FIT) rate. Refer to SBAA403 application

note for additional details

6.4 Thermal Information AFE79xx

THERMAL METRIC(1)

17mmx17mm FC-BGA

UNIT

400 PINS

RθJA

Junction-to-ambient thermal resistance

16.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.42

°C/W

RθJB

Junction-to-board thermal resistance

4.85

°C/W

ΨJT

Junction-to-top characterization parameter

0.12

°C/W

ΨJB

Junction-to-board characterization parameter

4.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

AFE7954

SBASAO7 – JULY 2023

Copyright © 2023 Texas Instruments Incorporated

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