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TX08DACP.B 데이터시트(PDF) 8 Page - Texas Instruments |
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TX08DACP.B 데이터시트(HTML) 8 Page - Texas Instruments |
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8 / 9 page ![]() PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TRAY L - Outer tray length without tabs KO - Outer tray height W - Outer tray width P1 - Tray unit pocket pitch CW - Measurement for tray edge (Y direction) to corner pocket center CL - Measurement for tray edge (X direction) to corner pocket center Text Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array matrix Max temperature (°C) L (mm) W (mm) K0 (µm) P1 (mm) CL (mm) CW (mm) TX08DACP ACP FCCSP 196 160 8 x 20 150 315 135.9 7620 15.4 11.2 19.65 TX08DACP.B ACP FCCSP 196 160 8 x 20 150 315 135.9 7620 15.4 11.2 19.65 Pack Materials-Page 1 |
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