EUA6027

DS6027 Ver 1.0 Feb. 2007

13

Thermal Pad Considerations

The thermal pad must be connected to ground. The package

with thermal pad of the EUA6027 requires special attention

on thermal design. If the thermal design issues are not

properly addressed, the EUA6027 will go into thermal

shutdown when driving a heavy load.

The thermal pad on the bottom of the EUA6027 should be

soldered down to a copper pad on the circuit board. Heat can

be conducted away from the thermal pad through the copper

plane to ambient. If the copper plane is not on the top

surface of the circuit board, 8 to 10 vias of 13 mil or smaller

in diameter should be used to thermally couple the thermal

pad to the bottom plane.

For good thermal conduction, the vias must be plated

through and solder filled. The copper plane used to conduct

heat away from the thermal pad should be as large as

practical.

If the ambient temperature is higher than 25℃,a larger

copper plane or forced-air cooling will be required to keep

the EUA6027 junction temperature below the thermal

shutdown

temperature

(150℃).

In

higher

ambient

temperature, higher airflow rate and/or larger copper area

will be required to keep the IC out of thermal shutdown.