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ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC

SLLSEI6G – SEPTEMBER 2014 – REVISED JANUARY 2017

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Product Folder Links: ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC

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Copyright © 2014–2017, Texas Instruments Incorporated

(1)

See the Safety-Related Certifications section for detailed isolation ratings.

9.3 Feature Description

The ISO734x family of devices are available in multiple channel configurations and default output state options to

enable wide variety of application uses.

PART NUMBER

CHANNEL DIRECTION

RATED ISOLATION

MAXIMUM DATA RATE

DEFAULT OUTPUT

ISO7340C

4 Forward,

0 Reverse

3000 VRMS / 4242 VPK

(1)

25 Mbps

High

ISO7340FC

Low

ISO7341C

3 Forward,

1 Reverse

High

ISO7341FC

Low

ISO7342C

2 Forward,

2 Reverse

High

ISO7342FC

Low

9.3.1 Electromagnetic Compatibility (EMC) Considerations

Many applications in harsh industrial environment are sensitive to disturbances such as electrostatic discharge

(ESD), electrical fast transient (EFT), surge, and electromagnetic emissions. These electromagnetic disturbances

are regulated by international standards such as IEC 61000-4-x and CISPR 22. Although system-level

performance and reliability depends, to a large extent, on the application board design and layout, the ISO734x

family of devices incorporates many chip-level design improvements for overall system robustness. Some of

these improvements include:

•

Robust ESD protection cells for input and output signal pins and inter-chip bond pads.

•

Low-resistance connectivity of ESD cells to supply and ground pins.

•

Enhanced performance of high voltage isolation capacitor for better tolerance of ESD, EFT and surge events.

•

Bigger on-chip decoupling capacitors to bypass undesirable high energy signals through a low impedance

path.

•

PMOS and NMOS devices isolated from each other by using guard rings to avoid triggering of parasitic

SCRs.

•

Reduced common mode currents across the isolation barrier by ensuring purely differential internal operation.