4

LM3555

SNVS594G – DECEMBER 2008 – REVISED APRIL 2016

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Copyright © 2008–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typical) and

disengages at TJ=135°C (typical). Thermal shutdown is specified by design.

(5)

For detailed soldering specifications and information, please refer to AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009).

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN

−0.3

6

V

TORCH, IND, STROBE, I2C/EN, SDA/EN2, SCL/EN1

−0.3

(VIN + 0.3 V) w/ 6 V

maximum

V

SW

12

V

VOUT, VLED

10

V

Continuous power dissipation(4)

Internally limited

Junction temperature, TJ-MAX

150

°C

Maximum lead temperature (soldering)

See(5)

Storage temperature, Tstg

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Ratings are

conditions under which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage

2.5

5.5

V

Junction temperature, TJ

−30

125

°C

Ambient temperature, TA

(3)

−30

85

°C