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LP38869 데이터시트(PDF) 2 Page - Texas Instruments

부품명 LP38869
상세설명  LP38869 1A FlexCap, Low-Dropout Linear Regulator with 0.75% Accuracy
PDF  27 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments

LP38869 데이터시트(HTML) 2 Page - Texas Instruments

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IN
IN
N/C
OUT
SET
GND
IN
SS
N/C
IN
OUT
OUT
OUT
N/C
1
2
3
4
8
7
6
5
9
10
11
12
13
14
15
16
Exposed Pad
on Bottom
(DAP)
RST
SHDN
LP38869
SNVS877B – AUGUST 2012 – REVISED APRIL 2013
www.ti.com
Connection Diagram
Figure 1. Top View
16-Pin HTSSOP
Pin Descriptions for 16-Pin HTSSOP Packages
Pin #
Pin Name
Description
Application Information
1
N/C
No Connection
No Internal Electrical Connection
Operates from +2.7V to +5.5V. Bypass capacitor is required, located close to the
2, 3, 4, 5
IN
Positive power input
package; 1
μF is recommended as a minimum value
Open-drain output is low when VOUT is 8% below normal regulation voltage. If
6
RST
RESET Output
regulation returns RST remains low for at least 3ms afterwards. Use large value
pull-up resistor (100 k
Ω) to VOUT to obtain output voltage.
A logic low state on the SHDN input will turn the regulator off, and will discharge
7
SHDN
SHUTDOWN Input
any capacitor on the SS pin. A logic high on the SHDN pin will turn the regulator
ON.
8
SS
Soft-Start control
Connect a capacitor from SS to GND. If SS is left open SS feature is disabled
9
N/C
No Connection
No Internal Electrical Connection
10
GND
Power Ground
Return connection for input and output voltages.
Used to select between Pre-Set Mode or Adjustable Mode. Connect to ground
11
SET
Operational Mode Selection
(Pre-Set Mode) or to a resistor divider from VOUT to SET pin to GND (Adjustable
Mode).
12, 13,
Regulated output voltage. A bypass capacitor is required, located close to the
OUT
Regulated output
14, 15
package; 1
μF recommended as the minimum value
16
N/C
No Connection
No Internal Electrical Connection
Solder the DAP to a copper plane under the package to improve thermal
Exposed
performance. DAP can be connected to ground at device Pin 10. Optionally, but
DAP
Thermal Connection
Pad
not recommended, the DAP can be left floating. Do not connect DAP to any
potential other than ground. See Operating Region and Power Dissipation.
2
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Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: LP38869



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