NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

.

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

METAL

SOLDER MASK

OPENING

LAND PATTERN EXAMPLE

SCALE: 30X

℄

SYMM

℄

SYMM

(Ø0.2) VIA

TYP

SEE DETAILS

1

3

4

6

(1.9)

6X (0.25)

6X (0.5)

4X (0.65)

(0.8)

(0.65)

(1.35)

EXAMPLE BOARD LAYOUT

4221434/C 01/2018

www.ti.com

USON - 0.65 mm mm max height

DNP0006A

PLASTIC SMALL OUTLINE NO-LEAD