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SCBU014 데이터시트(PDF) 13 Page - Texas Instruments |
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SCBU014 데이터시트(HTML) 13 Page - Texas Instruments |
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13 / 34 page ![]() www.ti.com 2.2 Mechanical Wafer Specification Mechanical Wafer Specification Table 2-4. General Mechanical Wafer Specification Parameter Value Wafer diameter 200 mm ±0.3 mm (8 inch) Thickness 711 μm Scribe line width 84 μm Electrical connection of substrate VSS potential Complete dies per wafer 24172 Table 2-5. Mechanical Wafer Specification After Grinding, Sawing on FFC Parameter Value Backside Material Si Roughness: Ra 500 ngstrom Rtm 2500 ngstrom Product RF-HDT-WNME-M0 711 μm RF-HDT-SNLE-G1 Thickness RF-HDT-SJLE-G1 150 μm ± 5 μm RF-HDT-AJLE-G1 SCBU047 (11-09-21-064) – October 2007 Specification 13 Submit Documentation Feedback |
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