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ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

PACKAGE DISSIPATION RATINGS

SN65CML100

SLLS547 – NOVEMBER 2002

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PART NUMBER

PART MARKING

PACKAGE

STATUS

SN65CML100D

CML100

SOIC

Production

SN65CML100DGK

NWB

MSOP

Production

over operating free-air temperature range unless otherwise noted(1)

UNIT

VCC

Supply voltage range(2)

–0.5 V to 4 V

IBB

Sink/source

±0.5 mA

Voltage range, (A, B, Y, Z)

0 V to 4.3 V

A, B, Y, Z, and GND

±5 kV

Human Body Model (3)

Electrostatic

All pins

±2 kV

discharge

Charged-Device Model(4)

All pins

±1500 V

Continuous power dissipation

See Dissipation Rating Table

Tstg

Storage temperature range

–65

°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-A.7.

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101.

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3

3.3

3.6

V

3.3-V nominal supply at terminator

3

3.3

3.6

V

VTT

Terminator supply voltage

2.5-V nominal supply at terminator

2.375

2.5

2.625

1.8-V nominal supply at terminator

1.7

1.9

V

|VID|

Magnitude of differential input voltage

0.1

1

V

Input voltage (any combination of common-mode or input signals)

0

4

V

VBB

Output current

400

µA

TA

Operating free-air temperature

–40

85

°C

TA ≤ 25°C

DERATING FACTOR(1)

TA = 85°C

PACKAGE

POWER RATING

ABOVE TA = 25°C

POWER RATING

DGK

425 mW

3.4 mW/

°C

221 mW

D

725 mW

5.8 mW/

°C

377 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

2

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