5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1) 2

MIN

MAX UNIT

VCCA

Supply voltage A

0.65

3.6

V

VCCB

Supply voltage B

0.65

3.6

V

VIH

High-level input voltage

Data Inputs

VCCI = 0.65V – 0.75V

VCCI × 0.70

VCCI = 0.76V – 1V

VCCI × 0.70

VCCI = 1.1V – 1.95V

VCCI × 0.65

VCCI = 2.3V – 2.7V

1.6

VCCI = 3V – 3.6V

2

Control Input (DIR), Referenced

to VCCA

VCCA = 0.65V – 0.75V

VCCA × 0.70

VCCA = 0.76V – 1V

VCCA × 0.70

VCCA = 1.1V – 1.95V

VCCA × 0.65

VCCA = 2.3V – 2.7V

1.6

VCCA = 3V – 3.6V

2

VIL

Low-level input voltage

Data Inputs

VCCI = 0.65V – 0.75V

VCCI x 0.30

V

VCCI = 0.76V – 1V

VCCI x 0.30

VCCI = 1.1V – 1.95V

VCCI x 0.35

VCCI = 2.3V – 2.7V

0.7

VCCI = 3V – 3.6V

0.8

Control Input (DIR), Referenced

to VCCA

VCCA = 0.65V – 0.75V

VCCA × 0.30

VCCA = 0.76V – 1V

VCCA × 0.30

VCCA = 1.1V – 1.95V

VCCA × 0.35

VCCA = 2.3V – 2.7V

0.7

VCCA = 3V – 3.6V

0.8

VI

Input voltage

0

3.6

V

VO

Output voltage

Active State

0

VCCO

V

Tri-State

0

3.6

Δt/Δv2

Input transition rise and fall time

10 ns/V

Δt/Δv3

Single channel input transition rise and fall time

100 ns/V

TA

Operating free-air temperature

–40

125

°C

(1)

VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port.

(2)

All unused inputs of the device must be held at VCC or GND for proper device operation. Refer to the TI application report, Implications

of Slow or Floating CMOS Inputs, SCBA004.

(3)

Input transition rate of a single channel while the other channels are at a valid logic state and not switching.

5.4 Thermal Information

THERMAL METRIC (1)

SN74AXC2T45-Q1

UNIT

DCT (SM8)

DCU (VSSOP) DTM (X2SON)

RθJA

Junction-to-ambient thermal resistance

223.5

242.9

225.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

120.7

96.2

131.6

°C/W

RθJB

Junction-to-board thermal resistance

138.0

153.3

141.3

°C/W

YJT

Junction-to-top characterization parameter

47.5

38.2

12.7

°C/W

YJB

Junction-to-board characterization parameter

136.7

152.5

140.9

°C/W

(1)

For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

SN74AXC2T45-Q1

SCES928B – APRIL 2021 – REVISED JANUARY 2024

www.ti.com

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