PCT2075

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© NXP Semiconductors N.V. 2017. All rights reserved.

Product data sheet

Rev. 9.1 — 21 April 2017

5 of 37

NXP Semiconductors

PCT2075

I2C-bus Fm+ digital temperature sensor and thermal watchdog

6.2 Pin description

[1]

HWSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The

GND pin must be connected to supply ground for proper device operation. For enhanced thermal,

electrical, and board-level performance, the exposed pad should be soldered to the board using a

corresponding thermal pad on the board, and for proper head conduction through the board thermal vias

need to be incorporated in the PCB in the thermal pad region.

Table 3.

Pin description for SO8, TSSOP8 and HWSON8

Symbol

Pin

Description

SDA

1

Digital I/O. I2C-bus serial bidirectional data line; open-drain.

SCL

2

Digital input. I2C-bus serial clock input.

OS

3

Overtemp Shutdown output; open-drain.

GND

4[1]

Ground. To be connected to the system ground.

A2

5

Digital input. User-defined address bit 2.

A1

6

Digital input. User-defined address bit 1.

A0

7

Digital input. User-defined address bit 0.

VCC

8

Power supply.

Table 4.

Pin description for TSOP6

Symbol

Pin

Description

A0

1

Digital input. User-defined address bit 0.

GND

2

Ground. To be connected to the system ground.

VCC

3

Power supply.

SCL

4

Digital input. I2C-bus serial clock input.

OS

5

Overtemp Shutdown output; open-drain.

SDA

6

Digital I/O. I2C-bus serial bidirectional data line; open-drain.