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TMP411 데이터시트(PDF) 4 Page - Texas Instruments

부품명 TMP411
상세설명  TMP411 ±1°C Remote and Local Temperature Sensor With N-Factor and Series Resistance Correction
PDF  48 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
Logo TI2 - Texas Instruments

TMP411 데이터시트(HTML) 4 Page - Texas Instruments

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TMP411
SBOS383D – DECEMBER 2006 – REVISED DECEMBER 2016
www.ti.com
Product Folder Links: TMP411
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
MIN
MAX
UNIT
Input voltage
Pins 2, 3, 4 only
–0.5
VS + 0.5
V
Input voltage
Pins 6, 7, 8 only
–0.5
7
V
Input current
10
mA
Power supply, Vs
7
V
Operating temperature range
–55
127
°C
Junction temperature, TJ(max)
150
°C
Storage temperature, Tstg
–60
130
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±3000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1000
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V+
Supply voltage
2.7
3.3
5.5
V
TA
Operating free-air temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
TMP411
UNIT
D (SOIC)
DGK (VSSOP)
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
112.3
166.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
59.4
58.3
°C/W
RθJB
Junction-to-board thermal resistance
53.0
86.7
°C/W
ψJT
Junction-to-top characterization parameter
13.6
7.5
°C/W
ψJB
Junction-to-board characterization parameter
52.4
85.2
°C/W



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