52

Am486DE2 Microprocessor

Notes:

1. All dimensions and tolerances conform to ANSI Y14.5M-1982.

2. DATUM Plane -A- is located at the mold parting line, and is coincedent with the bottom of the lead where the lead exits the

plastic body.

3. Dimensions “D1" and ”E1" do not include mold protrusions. Allowable protrusion is 0.25mm per side. Dimensions “D1" and ”E1"

include mold mismatch, and are determined at DATUM plane -A-.

4. Dimension “b” does not include DAMBAR protrusion.

5. Controlling dimensions: Millimeter.

6. Dimensions “D” and “E” are measured from outermost points.

7. Pin No. 1 ID may be inside top ejector mark, or separate.

8. Heatsink centerline to be aligned with package centerline

±0.30.

9. Half span (Center of package to lead tip) shall be 15.30

±0.165[0.602"±0.0065"]

10. No lead distortion (bent leads etc...) shall cause deviation from true position greater than

±0.04[0.0016"] at “b max”.

11. Lead coplanarity with respect to the seating plane shall not exeed 0.08[0.0031"].

AMD, the AMD logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

Am386, and Am486 are registered trademarks of Advanced Micro Devices, Inc.

FusionE86 is a service mark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

0.10

0.20

Gage Plane

0.25

0.20

± 0.10

0

° Min.

0.40 Min. Flat Shoulder

12~ 16

°

12~ 16

°

0

°-7°

10

11

0.08

4

4.00

Detail H

0.50

0.75

1.30

Nom.

Section S-S

0.17

0.27

0.17

0.27