2

TMP302-Q1

SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018

www.ti.com

Product Folder Links: TMP302-Q1

Submit Documentation Feedback

Copyright © 2014–2018, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 3

6

Pin Configuration and Functions ......................... 3

7

Specifications......................................................... 4

7.1

Absolute Maximum Ratings ...................................... 4

7.2

ESD Ratings.............................................................. 4

7.3

Recommended Operating Conditions ....................... 4

7.4

Thermal Information .................................................. 4

7.5

Electrical Characteristics........................................... 5

7.6

Typical Characteristics .............................................. 5

8

Detailed Description .............................................. 7

8.1

Overview ................................................................... 7

8.2

Functional Block Diagram ......................................... 7

8.3

Feature Description................................................... 8

8.4

Device Functional Modes.......................................... 8

9

Application and Implementation .......................... 9

9.1

Application Information.............................................. 9

9.2

Typical Application ................................................... 9

10

Power Supply Recommendations ..................... 11

11

Layout................................................................... 11

11.1

Layout Guidelines ................................................. 11

11.2

Layout Example .................................................... 11

12

Device and Documentation Support ................. 12

12.1

Receiving Notification of Documentation Updates 12

12.2

Community Resource............................................ 12

12.3

Trademarks ........................................................... 12

12.4

Electrostatic Discharge Caution ............................ 12

12.5

Glossary ................................................................ 12

13

Mechanical, Packaging, and Orderable

Information ........................................................... 12

4 Revision History

Changes from Revision B (July 2015) to Revision C

Page

•

Changed the supply voltage maximum value from: 3.6 V to: 4 V .......................................................................................... 4

•

Changed the input pin supply voltage maximum value from: VS + 0.5 V to: VS + 0.3 and ≤ 4 V........................................... 4

•

Changed the output pin voltage maximum value from: 3.6 V to: 4 V..................................................................................... 4

•

Added the specified temperature to the Recommended Operating Conditions table ........................................................... 4

•

Updated junction-to-ambient thermal resistance from 200 to 210.3 ..................................................................................... 4

•

Updated junction-to-case (top) thermal resistance from 73.7 to 105.0 ................................................................................. 4

•

Updated junction-to-board thermal resistance from 34.4 to 87.5 .......................................................................................... 4

•

Updated junction-to-top characterization parameter from 3.1 to 6.1 ..................................................................................... 4

•

Updated junction-to-board characterization parameter from 34.2 to 87.0 ............................................................................. 4

•

Changed the Design Requirements section ........................................................................................................................ 10

•

Added the Receiving Notification of Documentation Updates section ................................................................................. 12

Changes from Revision A (November 2014) to Revision B

Page

•

Changed the Handling Ratings table to ESD Ratings and moved storage temperature to the Absolute Maximum

Ratings table .......................................................................................................................................................................... 4

Changes from Original (October 2014) to Revision A

Page

•

Changed device status From: Product Preview To: Production............................................................................................. 1