5.4 Thermal Information (DEN Package)

THERMAL METRIC(1)

DEN (VSON)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

64.7

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

53.7

°C/W

RθJB

Junction-to-board thermal resistance

29.6

°C/W

ΨJT

Junction-to-top characterization parameter

10.1

°C/W

ΨJB

Junction-to-board characterization parameter

29.4

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

23.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Package Characteristics

PARAMETER

TEST CONDITIONS

VALUE

UNIT

DEN PACKAGE

CLR

External clearance

Shortest pin-to-pin distance through air

≥ 1

mm

CPG

External creepage

Shortest pin-to-pin distance across the

package surface

≥ 1

mm

CTI

Comparative tracking index

DIN EN 60112 (VDE 0303-11); IEC 60112

≥ 600

V

Material group

According to IEC 60664-1

I

CIO

Capacitance, input to output(1)

VIO = 0.5 VPP at 1MHz

~1.5

pF

RIO

Resistance, input to output(1)

TA = 25°C

> 1012

Ω

(1)

All pins on each side of the barrier are tied together, creating a two-pin device.

AMC0106M25

SBASAX1 – AUGUST 2024

www.ti.com

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