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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LSF0108 데이터시트(PDF) 210 Page - Nexperia B.V. All rights reserved |
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LSF0108 데이터시트(HTML) 210 Page - Nexperia B.V. All rights reserved |
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210 / 234 page  Nexperia selection guide 2020 210 Minimized outline drawings and reflow soldering footprint 8-pin SMD packages Dimensions in mm Images are for reference only, for detailed drawings please visit nexperia.com/packages TSSOP8 (SOT505-2) TSSOP8 (SOT505-2) 14-10-01 Dimensions in mm 14 8 5 0.47 0.33 1.1 max 0.18 0.08 3.1 2.9 4.1 3.9 3.1 2.9 0.38 0.22 0.65 0.15 0.00 SOT505-2 Footprint information for reflow soldering of TSSOP8 package sot505-2_fr Issue date 17-12-01 17-12-04 occupied area solder paste deposit solder land solder land plus solder paste 0.4 0.95 0.75 0.85 0.5 0.6 0.3 0.4 0.5 0.125 2.7 4.4 3.6 0.7 0.65 0.7 0.125 2.8 3.6 4.65 SOT505-2 Footprint information for reflow soldering of TSSOP8 package sot505-2_fr Issue date 17-12-01 17-12-04 occupied area solder paste deposit solder land solder land plus solder paste 0.4 0.95 0.75 0.85 0.5 0.6 0.3 0.4 0.5 0.125 2.7 4.4 3.6 0.7 0.65 0.7 0.125 2.8 3.6 4.65 LFPAK56D (SOT1205) Package outline © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands www.nxp.com References Outline version European projection Issue date IEC JEDEC JEITA SOT1205 sot1205_po 13-02-19 13-02-21 Unit mm max nom min 1.05 0.1 0.0 4.4 4.1 0.25 0.19 0.30 0.24 4.70 4.45 3.5 5.30 4.95 0.85 0.85 0.40 A Dimensions Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. Plastic single ended surface mounted package (LFPAK56D); 8 leads SOT1205 A1 b 0.50 0.35 b1 c c1 D(1) 0.1 8° 0° y θ D1(1) 4.8 D2 (ref) E (1) E1(1) 1.8 1.6 E2 e 1.27 H 6.2 5.9 L 1.3 0.8 L1 0.55 0.30 Lp 0.25 w 0 2.5 5 mm scale detail X A1 C Lp θ C y E2 D2 E1 D1 mounting base c X A c1 A e b (8x) w A D E H L L1 b1 1 2 3 4 LFPAK56D (SOT1205) Reflow soldering footprint © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands www.nxp.com SOT1205 Footprint information for reflow soldering of LFPAK56D package sot1205_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm Reflow soldering footprint © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands www.nxp.com 1.27 0.7 (4x) SOT1205 Footprint information for reflow soldering of LFPAK56D package sot1205_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm 5.85 0.8 2.0 1.0 (2x) 2.1 3.2 3.325 2.7 3.85 3.975 1.275 3.175 1.875 0.0625 0.025 3.81 3.81 1.44 1.27 1.1 (2x) 0.7 (4x) TSSOP8 (SOT530-1) TSSOP8 (SOT530-1) Nexperia SOT530-1 plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body 3. Soldering SOT530-1 Footprint information for reflow soldering of TSSOP8 package sot530-1_fr Issue date 09-12-13 18-10-08 0.125 1.25 1.35 1.45 0.125 3.0 0.65 0.75 3.8 5.3 7.2 7.45 recommended stencil thickness: 0.125 mm occupied area solder paste solder resist solder land 0.5 0.6 0.7 0.3 0.4 0.5 4.5 Fig. 2. Reflow soldering footprint for TSSOP8 (SOT530-1) SOT530-1 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 18 October 2018 3 / 5 Nexperia SOT530-1 plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body 3. Soldering SOT530-1 Footprint information for reflow soldering of TSSOP8 package sot530-1_fr Issue date 09-12-13 18-10-08 0.125 1.25 1.35 1.45 0.125 3.0 0.65 0.75 3.8 5.3 7.2 7.45 recommended stencil thickness: 0.125 mm occupied area solder paste solder resist solder land 0.5 0.6 0.7 0.3 0.4 0.5 4.5 Fig. 2. Reflow soldering footprint for TSSOP8 (SOT530-1) SOT530-1 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 18 October 2018 3 / 5 Nexperia SOT530-1 plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body 2. Package outline UNIT A1 A max. A2 A3 bp L HE Lp w y v c e D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.85 0.30 0.19 0.20 0.13 3.1 2.9 4.5 4.3 0.65 6.5 6.3 0.70 0.35 8° 0° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.5 SOT530-1 MO-153 00-02-24 03-02-18 w M bp D Z e 0.25 1 4 8 5 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1 1.1 pin 1 index Fig. 1. Package outline TSSOP8 (SOT530-1) SOT530-1 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 18 October 2018 2 / 5 Nexperia SOT530-1 plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body 2. Package outline UNIT A1 A max. A2 A3 bp L HE Lp w y v c e D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.85 0.30 0.19 0.20 0.13 3.1 2.9 4.5 4.3 0.65 6.5 6.3 0.70 0.35 8° 0° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.5 SOT530-1 MO-153 00-02-24 03-02-18 w M bp D Z e 0.25 1 4 8 5 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1 1.1 pin 1 index Fig. 1. Package outline TSSOP8 (SOT530-1) SOT530-1 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 18 October 2018 2 / 5 XSON8 (SOT996-2) XSON8 (SOT996-2) 14-09-30 Dimensions in mm 0.5 0.05 0.00 0.6 0.4 3.1 2.9 2.1 1.9 1.5 0.35 0.15 0.5 14 85 0.5 0.3 |
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