LSF0108 datasheet(214/234 Pages) NEXPERIA

214 / 234 page

Nexperia selection guide 2020

214

Minimized outline drawings and reflow soldering footprint

Dimensions in mm

Images are for reference only, for detailed drawings please visit nexperia.com/packages

16-pin SMD packages

20-pin SMD packages

SO16 (SOT109-1)

SOT109-1

Footprint information for reflow soldering of SO16 package

sot109-1_fr

Issue date 09-10-25

18-10-08

0.125

1.32

1.65

1.75

1.85

1.27

0.125

10.04

11.9

5.2 7.4 7.65

recommended stencil thickness: 0.15 mm

occupied area

solder paste

solder resist

solder land

0.7

0.8

0.9

0.6

0.7

0.8

3.9

SOT109-1

Footprint information for reflow soldering of SO16 package

sot109-1_fr

Issue date 09-10-25

18-10-08

0.125

1.32

1.65

1.75

1.85

1.27

0.125

10.04

11.9

5.2 7.4 7.65

recommended stencil thickness: 0.15 mm

occupied area

solder paste

solder resist

solder land

0.7

0.8

0.9

0.6

0.7

0.8

3.9

03-02-19

Dimensions in mm

1.27

0.49

0.36

10.0

9.8

4.0

3.8

6.2

5.8

pin 1 index

0.25

0.19

1.0

0.4

1.75

max

SO20 (SOT163-1)

sot163-1_fr

occupied area

solder lands

Dimensions in mm

placement accuracy ± 0.25

1.50

0.60 (20×)

1.27 (18×)

8.00 11.00

13.40

11.40

sot163-1_fr

occupied area

solder lands

Dimensions in mm

placement accuracy ± 0.25

1.50

0.60 (20×)

1.27 (18×)

8.00 11.00

13.40

11.40

sot163-1_fr

occupied area

solder lands

Dimensions in mm

placement accuracy ± 0.25

1.50

0.60 (20×)

1.27 (18×)

8.00 11.00

13.40

11.40

03-02-19

Dimensions in mm

1.27

2.65

max

13.0

12.6

7.6

7.4

1.1

0.4

0.49

0.36

0.32

0.23

10.65

10.00

pin 1 index

TSSOP16 (SOT403-1)

SOT403-1

Footprint information for reflow soldering of TSSOP16 package

sot403-1_fr

Issue date 17-11-28

17-12-01

occupied area

solder paste deposit

solder land

solder land plus solder paste

recommended stencil thickness: 0.125 mm

1.35

5.30

7.45

0.125

4.50

1.25

7.20

0.60

0.3

0.5

0.75

0.40

0.65

0.125

5.60

5.80

SOT403-1

Footprint information for reflow soldering of TSSOP16 package

sot403-1_fr

Issue date 17-11-28

17-12-01

occupied area

solder paste deposit

solder land

solder land plus solder paste

recommended stencil thickness: 0.125 mm

1.35

5.30

7.45

0.125

4.50

1.25

7.20

0.60

0.3

0.5

0.75

0.40

0.65

0.125

5.60

5.80

DHVQFN16 (SOT763-1)

Nexperia

SOT763-1

plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5

mm pitch; 3.5 mm x 2.5 mm x 1 mm body

3. Soldering

SOT763-1

Footprint information for reflow soldering of DHVQFN16 package

0.500

0.105

2.800

0.400

0.025

0.900

1.700

3.500

3.750

3.800

1.100

1.900

2.700

4.500

4.750

0.025

0.400

0.240

sot763-1_fr

occupied area

solder land plus solder paste

solder land

solder paste deposit

Fig. 2. Reflow soldering footprint for DHVQFN16 (SOT763-1)

SOT763-1

All information provided in this document is subject to legal disclaimers.

Package information

14 November 2018

3 / 5

SOT763-1

Footprint information for reflow soldering of DHVQFN16 package

Refer to the package outline drawing for actual layout

0.500

0.105

2.800

0.400

0.025

0.900

1.700

3.500

3.750

3.800

1.100

1.900

2.700

4.500

4.750

0.025

0.400

0.240

sot763-1_fr

occupied area

solder land plus solder paste

solder land

solder paste deposit

03-01-27

Dimensions in mm

0.5

1.0 max

0.05

0.00

1.15

0.85

2.6

2.4

3.6

3.4

2.5

2.15

1.85

0.5

0.3

0.30

0.18

0.5

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