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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LSF0108 데이터시트(PDF) 217 Page - Nexperia B.V. All rights reserved |
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LSF0108 데이터시트(HTML) 217 Page - Nexperia B.V. All rights reserved |
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217 / 234 page  217 Minimized outline drawings and reflow soldering footprint Dimensions in mm Images are for reference only, for detailed drawings please visit nexperia.com/packages 56-pin SMD packages TSSOP56 (SOT364-1) TSSOP56 (SOT364-1) SOT364-1 Footprint information for reflow soldering of TSSOP56 package sot364-1_fr Issue date 13-07-02 18-10-09 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.4 0.28 0.22 0.125 0.56 14.12 14.27 16.6 0.125 6.1 8.9 7.0 9.15 0.5 1.5 1.4 SOT364-1 Footprint information for reflow soldering of TSSOP56 package sot364-1_fr Issue date 13-07-02 18-10-09 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.4 0.28 0.22 0.125 0.56 14.12 14.27 16.6 0.125 6.1 8.9 7.0 9.15 0.5 1.5 1.4 03-02-19 Dimensions in mm 1.2 max 29 56 14.0 28 1 8.1 6.1 |
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