5

LP5907-Q1

www.ti.com

SNVSA34E – SEPTEMBER 2014 – REVISED DECEMBER 2019

Product Folder Links: LP5907-Q1

Submit Documentation Feedback

Copyright © 2014–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the GND pin.

(3)

Abs Max VOUT is the VIN + 0.3 V or 6 V, whichever is less.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN

Input voltage

–0.3

6

V

VOUT

Output voltage

–0.3

See (3)

V

VEN

Enable input voltage

–0.3

6

V

Continuous power dissipation(4)

Internally limited

W

TJMAX

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC

Q100-002(1)

All pins

±2000

V

Charged-device model (CDM), per AEC

Q100-011

Corner pins (1,3,4,5)

±1000

Other pin (2)

±1000

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the GND pin.

(3)

TJ-MAX-OP = [TA(MAX) + (PD(MAX) × RθJA )].

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN

Input supply voltage

2.2

5.5

V

VEN

Enable input voltage

0

5.5

V

IOUT

Output current

0

250

mA

TJ-MAX-OP

Operating junction temperature(3)

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LP5907-Q1

UNIT

DBV (SOT-23)

DQN (X2SON-4)

5 PINS

4-PINS

RθJA

Junction-to-ambient thermal resistance

186.9

197.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

112.3

139.4

°C/W

RθJB

Junction-to-board thermal resistance

52.3

130.2

°C/W

ψJT

Junction-to-top characterization parameter

27.5

6.4

°C/W

ψJB

Junction-to-board characterization parameter

51.8

130.2

°C/W

RθJC(top)

Junction-to-case (bottom) thermal resistance

—

139.6

°C/W