8.2.3 Thermal Board Recommendations

The TI module uses µvias for layers 1 through 4 with full copper filling, providing heat flow all the way to the

module ground pads.

TI recommends using one big ground pad under the module with vias all the way to connect the pad to all

ground layers (see Block of Ground Pads on the Bottom Side of Package).

Figure 8-3. Block of Ground Pads on the Bottom Side of Package

For more general layout recommendations, refer to the CC33xx Hardware Integration document. This document

describes how to integrate the CC330xMOD into any system, and the hardware requirements for this device.

Layout and schematic considerations are listed here as well, which TI highly recommends following to achieve

the device performance listed in this data sheet.

CC3300MOD, CC3301MOD

SWRS333A – JULY 2025 – REVISED AUGUST 2025

www.ti.com

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