TS4962_V01 datasheet(41/44 Pages) STMICROELECTRONICS

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TS4962

Package information

Figure 71. DFN8 3 x 3 exposed pad package mechanical drawing (pitch 0.65 mm)

Table 12. DFN8 3 x 3 exposed pad package mechanical data (pitch 0.65 mm)

Note:

The pin 1 identifier must be visible on the top surface of the package by using an indentation

mark or other feature of the package body. Exact shape and size of this feature are optional.

The dimension L does not conform with JEDEC MO-248, which recommends

0.40+/-0.10 mm.

For enhanced thermal performance, the exposed pad must be soldered to a copper area on

the PCB, acting as a heatsink. This copper area can be electrically connected to pin 7 or left

floating.

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

0.50

0.60

0.65

0.020

0.024

0.026

0.02

0.05

0.0008

0.002

0.22

0.009

0.25

0.30

0.35

0.010

0.012

0.014

2.85

3.00

3.15

0.112

0.118

0.124

1.60

1.70

1.80

0.063

0.067

0.071

2.85

3.00

3.15

0.112

0.118

0.124

1.10

1.20

1.30

0.043

0.047

0.051

0.65

0.026

0.50

0.55

0.60

0.020

0.022

0.024

ddd

0.08

0.003

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