www.ti.com

EXAMPLE STENCIL DESIGN

(9.1)

6X (2.54)

8X (0.65)

8X (2.35)

(R0.05)

TYP

8X (2.35)

8X (0.65)

6X (2.54)

(9.45)

(R0.05)

TYP

4222355/G 04/2019

SOP - 4.85 mm max height

DUB0008A

SMALL OUTLINE PACKAGE

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

IPC-7351 NOMINAL

6.75 mm CLEARANCE/CREEPAGE

HV / ISOLATION OPTION

7.1 mm CLEARANCE/CREEPAGE

SYMM

SYMM

1

4

5

8

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:5X

SYMM

SYMM

1

4

5

8