10 Layout

10.1 Layout Guidelines

Figure 10-1 shows a layout recommendation with the critical placement of the decoupling capacitors (as close as

possible to the AMC3302 supply pins) and placement of the other components required by the device. For best

performance, place the shunt resistor close to the INP and INN inputs of the AMC3302 and keep the layout of

both connections symmetrical.

To avoid errors in the measurement caused by the input bias currents of the AMC3302, connect the high-side

ground pin (HGND) to the IIN-side of the shunt resistor. Use a separate trace in the layout to make this

connection to maintain equal currents in the IIN and INP traces.

10.2 Layout Example

R4

R2

AMC3302

Clearance area, to be

kept free of any

conductive materials.

To MCU I/O (optional)

GND

INP

INN

3.3-V or 5-V supply

HGND

VDD

DIAG

Top Metal

Inner or Bottom Layer Metal

Via

OUTP

OUTN

To analog filter / ADC / MCU

To analog filter / ADC / MCU

C3

C2

C1

C5

C6

FB2

FB1

FB3

Figure 10-1. Recommended Layout of the AMC3302

AMC3302

SBASA11B – AUGUST 2020 – REVISED JULY 2021

www.ti.com

28

Submit Document Feedback

Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: AMC3302