STA333W datasheet(44/50 Pages) STMICROELECTRONICS

44 / 50 page

Package thermal characteristics

STA333W

44/50

DocID13365 Rev 3

Package thermal characteristics

A thermal resistance of 25 °C/W can be achieved by mounting the device on a PCB which

has two copper ground areas of 3 x 3 cm and 16 vias (see Figure 21).

Given that the amount of power dissipated within the device depends primarily on the supply

voltage, load impedance and output modulation level the maximum estimated dissipated

power for the STA333W is 3 W.

With the above suggested board as heatsink, a maximum junction temperature rise,

Tj, of

75 °C is possible. In consumer environments where 50 °C is the maximum ambient

temperature this provides some safety margin before the intervention of the thermal

protection (Tj = 150 °C).

Figure 21. Double-layer PCB with two copper ground areas and 16 vias

Figure 22 shows the power derating curve for the PowerSSO-36 package on PCBs with

copper areas of 2 x 2 cm2 and 3 x 3 cm2.

Figure 22. Power derating curve for PCB used as heatsink

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA333W

PSSO36

Copper Area 3x3 cm

and via holes

100

120

140

160

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

Copper Area 2x2 cm

and via holes

STA333W

PSSO36

STA333W

PSSO36

Copper Area 3x3 cm

and via holes

Copper Area 3x3 cm

and via holes

STA333W

PowerSSO-36

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