Package and PCB thermal data

L5150CJ, L5150CS

22/34

DS6184 Rev 18

4.2

SO-8 thermal data

Figure 30. SO-8 PC board(1)

1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,

FR4 area = 48 mm x 48 mm, PCB thickness = 2 mm, Cu thickness = 35 µm (front and back side),



Cu thickness on vias 25 µm, Footprint dimension 4.1 mm x 6.5 mm).

Figure 31. Rthj-amb vs. PCB copper area in open box free air condition

GAPGCFT00158

RTHjamb

110

115

120

125

130

0

0.5

1

1.5

2

2.5

RTHjamb

GAPGCFT00159