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L9362

THERMAL DATA

ABSOLUTE MAXIMUM RATINGS

For externally applied voltages or currents exceeding these limits damage of the circuit may occur

Note:

The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent

damage to the IC will result.

25

NON3

Inverted Control Signal Input

Digital input, Schmitt trigger, internal Pullup current

26

NRES

Inverted Reset Input

Digital input, Schmitt trigger, internal Pullup current

27

N.C.

28

VCC

5V Supply Voltage Input

29

N.C.

30

NON2

Inverted Control Signal Input

Digital input, Schmitt trigger, internal Pullup current

31

NON1

Inverted Control Signal Input

Digital input, Schmitt trigger, internal Pullup current

32

OUT2

Output Power Switch

33

OUT2

Output Power Switch

34

CFB2

Output Current feedback

Sinks current proportional to IOUT2

35

N.C.

36

PGND2

Power Ground

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Thermal resistance

Rth j-case

Thermal resistance junction to case

(one powerstage in use)

Die must be

soldered on the

frame.

4.5

°C/W

Rthja

Thermal resistance junction-ambient

pad layout

50

°C/W

Rthja

Thermal resistance junction-ambient

pad layout + 6 cm2

on board heat sink

35

°C/W

ESD

ESD

MIL 883C

2KV

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Supply Voltages

VCC

Supply voltage

-0.3

7

V

Outputs (Out 1 ... 4)

VOut

Continues output voltage

With no reverse

current.

-0.3

45

V

Ioutc

Continues current

3.0

A

ISCBpeak

Peak output current

-10

I_SCB

A

WOFF

Clamped energy at the switching OFF

For 2ms, see fig. 8

50

mJ

Inputs (NONx; NCS; CLK; NRES; SDI)

VIN

Input voltage

-0.3

7

V

Outputs (SDO; CFB)

VOUT

Output voltage

-0.3

VCC

+0.3

V

Operating junction temperature

Tj

Operating junction temperature

-40

150

°C

PIN FUNCTIONS (continued)

Pin No.

Pin Name

Pin Description

Notes