6

Package and PCB thermal data

6.1

PowerSSO-12 thermal data

Figure 39. PowerSSO-12 PC board

Note:

The values quoted are for PCB 77 mm x 86 mm x 1.6 mm, FR4, two and four layers; Cu thickness 0.070 mm

(outer layers). Cu thickness 0.035 mm (inner layers), thermal vias separation 1.2 mm, thermal via diameter

0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, footprint dimension 2.2 mm x 2.9 mm.

L99VR01

Package and PCB thermal data

DS13649 - Rev 4

page 24/40