CSD87381P

SLPS405F – MARCH 2013 – REVISED MARCH 2015

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Table of Contents

1

Features .................................................................. 1

7

Layout ................................................................... 14

7.1

Layout Guidelines ................................................... 14

2

Applications ........................................................... 1

7.2

Layout Example ...................................................... 14

3

Description ............................................................. 1

8

Device and Documentation Support.................. 15

4

Revision History..................................................... 2

8.1

Trademarks ............................................................. 15

5

Specifications......................................................... 3

8.2

Electrostatic Discharge Caution .............................. 15

5.1

Absolute Maximum Ratings ...................................... 3

8.3

Glossary .................................................................. 15

5.2

Recommended Operating Conditions ....................... 3

9

Mechanical, Packaging, and Orderable

5.3

Power Block Performance ........................................ 3

Information ........................................................... 16

5.4

Thermal Information .................................................. 4

9.1

CSD87381P Package Dimensions ......................... 16

5.5

Electrical Characteristics........................................... 4

9.2

Land Pattern Recommendation .............................. 17

5.6

Typical Power Block Characteristics......................... 5

9.3

Stencil Recommendation (100 µm)......................... 18

5.7

Typical Power Block MOSFET Characteristics......... 7

9.4

Stencil Recommendation (125 µm)......................... 18

6

Application and Implementation ........................ 10

9.5

Pin Drawing............................................................. 19

6.1

Application Information............................................ 10

9.6

CSD87381P Embossed Carrier Tape Dimensions . 19

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (June 2014) to Revision F

Page

•

Changed capacitance units to read pF in Figure 15 ............................................................................................................. 8

•

Changed capacitance units to read pF in Figure 16 ............................................................................................................. 8

Changes from Revision D (May 2014) to Revision E

Page

•

Changed "Pb Free terminal plating" feature to state "Pb Free" ............................................................................................ 1

Changes from Revision C (January 2014) to Revision D

Page

•

Updated data sheet to reflect new standards......................................................................................................................... 1

•

Corrected device dimensions ................................................................................................................................................ 1

Changes from Revision B (May 2013) to Revision C

Page

•

Updated title............................................................................................................................................................................ 1

•

Added small reel info .............................................................................................................................................................. 1

•

Added unit to test condition in Electrical Characteristics........................................................................................................ 4

•

Added a link for Figure 29 in Electrical Performance ........................................................................................................... 14

Changes from Revision A (March 2013) to Revision B

Page

•

Changed RθJC-PCB To: RθJC in the Thermal Information table.................................................................................................. 4

•

Changed Figure 15 ................................................................................................................................................................. 7

Changes from Original (March 2013) to Revision A

Page

•

Changes to a Product Preview device .................................................................................................................................. 1

2

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