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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32L151VD 데이터시트(PDF) 143 Page - STMicroelectronics |
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STM32L151VD 데이터시트(HTML) 143 Page - STMicroelectronics |
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143 / 154 page  DocID022027 Rev 11 143/154 STM32L151xD STM32L152xD Package information 153 Figure 53. WLCSP64, 0.4 mm pitch wafer level chip scale package recommended footprint b(2) 0.240 0.270 0.300 0.0094 0.0106 0.0118 D 4.504 4.539 4.574 0.1773 0.1787 0.1801 E 4.876 4.911 4.946 0.1920 0.1933 0.1947 e - 0.400 - - 0.0157 - e1 - 2.800 - - 0.1102 - F - 0.870 - - 0.0343 - G - 1.056 - - 0.0416 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 79. WLCSP64, 0.4 mm pitch package recommended PCB design rules Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. Table 78. WLCSP64, 0.4 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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