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STM32L443CC 데이터시트(PDF) 103 Page - STMicroelectronics

부품명 STM32L443CC
상세설명  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, 256KB Flash, 64KB SRAM, USB FS, LCD, analog, audio, AES
PDF  215 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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STM32L443CC 데이터시트(HTML) 103 Page - STMicroelectronics

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 103 / 215 page
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DS11421 Rev 4
103/215
STM32L443CC STM32L443RC STM32L443VC
Electrical characteristics
185
Table 29. Typical current consumption in Run and Low-power run modes, with different codes
running from Flash, ART disable
Symbol
Parameter
Conditions
TYP
Unit
TYP
Unit
-
Voltage
scaling
Code
25 °C
25 °C
IDD_ALL
(Run)
Supply
current in
Run mode
fHCLK = fHSE up to
48 MHz included,
bypass mode
PLL ON above
48 MHz
all peripherals
disable
Reduced code(1)
2.66
mA
102
µA/MHz
Coremark
2.44
94
Dhrystone 2.1
2.46
95
Fibonacci
2.27
87
While(1)
2.20
84.6
Reduced code(1)
8.56
mA
107
µA/MHz
Coremark
8.00
100
Dhrystone 2.1
7.98
100
Fibonacci
7.41
93
While(1)
7.83
98
IDD_ALL
(LPRun)
Supply
current in
Low-power
run
fHCLK = fMSI = 2 MHz
all peripherals disable
Reduced code(1)
310
µA
155
µA/MHz
Coremark
342
171
Dhrystone 2.1
324
162
Fibonacci
324
162
While(1)
384
192
1. Reduced code used for characterization results provided in Table 25, Table 26, Table 27.
Table 30. Typical current consumption in Run and Low-power run modes, with different codes
running from SRAM1
Symbol
Parameter
Conditions
TYP
Unit
TYP
Unit
-
Voltage
scaling
Code
25 °C
25 °C
IDD_ALL
(Run)
Supply
current in
Run mode
fHCLK = fHSE up to
48 MHz included,
bypass mode
PLL ON above
48 MHz all
peripherals
disable
Reduced code(1)
2.42
mA
93
µA/MHz
Coremark
2.18
84
Dhrystone 2.1
2.40
92
Fibonacci
2.40
92
While(1)
2.29
88
Reduced code(1)
8.63
mA
108
µA/MHz
Coremark
7.76
97
Dhrystone 2.1
8.55
107
Fibonacci
8.56
107
While(1)
8.12
102
IDD_ALL
(LPRun)
Supply
current in
Low-power
run
fHCLK = fMSI = 2 MHz
all peripherals disable
Reduced code(1)
205
µA
103
µA/MHz
Coremark
188
94
Dhrystone 2.1
222
111
Fibonacci
204
102
While(1)
211
106
1. Reduced code used for characterization results provided in Table 25, Table 26, Table 27.



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