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STM32L443CC 데이터시트(PDF) 198 Page - STMicroelectronics |
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STM32L443CC 데이터시트(HTML) 198 Page - STMicroelectronics |
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198 / 215 page ![]() Package information STM32L443CC STM32L443RC STM32L443VC 198/215 DS11421 Rev 4 Figure 55. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale package recommended footprint b(3) 0.190 0.220 0.250 0.0075 0.0087 0.0098 D 3.106 3.141 3.176 0.1223 0.1237 0.1250 E 3.092 3.127 3.162 0.1217 0.1231 0.1245 e - 0.350 - - 0.0138 - e1 - 2.450 - - 0.0965 - e2 - 2.450 - - 0.0965 - F - 0.3455 - - 0.0136 - G - 0.3385 - - 0.0133 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 99. WLCSP64 recommended PCB design rules (0.35 mm pitch) Dimension Recommended values Pitch 0.35 mm Dpad 0.210 mm Dsm 0.275 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.235 mm Stencil thickness 0.100 mm Table 98. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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